A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints
نویسندگان
چکیده
منابع مشابه
Fatigue fracture of SnAgCu solder joints by microstructural modeling
The ongoing miniaturization trend in the microelectronic industry enforces component sizes to approach the micron, or even the nano scale. At these scales, the underlying microstructural sizes and the geometrical dimensions are comparable. The increasing influence of microscopic entities on the overall mechanical properties makes conventional continuum material models more and more questionable...
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ژورنال
عنوان ژورنال: Journal of Electronic Materials
سال: 2018
ISSN: 0361-5235,1543-186X
DOI: 10.1007/s11664-018-6121-0